Thin film lithium niobate is used in next-generation photonics across defense systems as well as commercial sectors including artificial intelligence, computing technologies, data centers and telecommunications. Raytheon stated that establishing a domestic alternative would make the material available to the broader defense industrial base and commercial industries.
“Global access to TFLN has become increasingly constrained, with supply consolidation leaving U.S. companies vulnerable to international disruptions,” said Colin Whelan, president of Advanced Technology at Raytheon. “Through this effort, Raytheon will stand up an independent U.S. supplier of next generation TFLN, building an open, third-party source that can serve a broad range of defense and commercial customers.”
Under the contract, Raytheon’s Advanced Technology team will use its expertise in ion slicing to support U.S.-based company G&H in developing a manufacturing process for high-quality wafers. Once established, production will transition to G&H in early 2026 for low-rate initial production, with both companies continuing close collaboration to ensure successful technology transfer and production readiness.
“Establishing G&H as a robust, domestic merchant supplier of thin film lithium niobate is essential for creating next-generation faster and more efficient photonic transmission and sensing systems,” said Dr. Stratos Kehayas, president, Photonics at G&H. “G&H’s vertically integrated crystal and wafer manufacturing capabilities enable the reliable transition of this technology into U.S.-based production, strengthening supply chain resilience for both defense and commercial applications.”
Raytheon is a major provider of defense solutions to the U.S. government and allied nations, with capabilities spanning air and missile defense, advanced sensors, space-based systems and hypersonics. RTX, headquartered in Arlington, Virginia, employs more than 180,000 people globally and reported sales of more than $88 billion in 2025.
