The chip was developed and made market-ready in under six months. Northrop Grumman said it delivers enhanced speed and bandwidth at high frequencies.
The company said the chip can enable military radar systems to send secure data wirelessly and quickly through satellites. It is also intended to support next-generation 5G and 6G connectivity.
Northrop Grumman described the chip as a compact and efficient system that strengthens wireless signals. It said the technology can make signals clearer and faster, supporting secure military communications and more reliable connections for everyday devices.
The chip’s compact and low-cost design is intended to replace larger and more power-intensive equipment. Northrop Grumman said the development helps maintain U.S. leadership in next-generation wireless technology.
The chip was manufactured at Northrop Grumman’s semiconductor facility in California. The company developed it through a project with the Microelectronics Commons California DREAMS hub, where Northrop Grumman is a leading partner.
The Microelectronics Commons programme is funded by the Office of the Under Secretary of War for Research and Engineering. Northrop Grumman said the programme brings together industry, government and academia to accelerate microchip innovation and deliver breakthrough technology to the field faster.
The company said its role in the programme helped lead to production of the GaN chip. Northrop Grumman said the work demonstrates its ability to manufacture American-made advanced semiconductor solutions for defence and commercial radio frequency applications.
