The investment focuses on components embedded in fighter aircraft, radars and satellites. These chips handle functions including signal processing and control logic, enabling systems to detect, process and respond to threats.
Northrop Grumman manufactures and procures millions of microchips in the United States each year. It operates three government-accredited manufacturing facilities across Maryland, California and Florida and plans to expand domestic capabilities and partnerships.
“With our deep end-to-end knowledge and manufacturing capabilities, we can deliver the right chip, with the right capability to the right mission, every time,” said Robert Mendoza, operations manager at the company’s Redondo Beach, California, microelectronics facility. “With our extensive background working with these technologies, we have perfected ways to add a broad range of functions to support our nation’s military and commercial needs.”
Advanced packaging reduces size and power requirements
Alongside chip fabrication, Northrop Grumman provides advanced packaging that combines chips with different properties and functions into a single solution. Three-dimensional stacking allows those components to deliver more functionality while occupying less space and consuming less power.
“These 3-dimensional chip-stacking methods allow our products to do more, faster – while taking up less space and using less power,” said Brittany Battaglia, Advanced Packaging Program Manager. “It’s critical technology.”
The company said it operates one of the few U.S.-based advanced packaging facilities. According to Northrop Grumman, 98% of American chipmakers must source those services internationally.
Manufacturing draws on more than 800 materials
Chip production begins with semiconductor wafers, typically made from silicon or compounds such as gallium arsenide and indium phosphide. Northrop Grumman said it has access to more than 800 materials to support its microelectronics work.
Wafers undergo repeated cycles of deposition, photolithography and etching to create the required devices. Once fabrication and testing are complete, individual chips are separated using diamond saw blades or lasers.
“Fabricating wafers is like baking a tiered cake — each layer uses different recipes and ingredients, and variables like temperature and time can affect the texture, taste, or look of the cake,” said Vicky Zheng, a process integration engineer at the company’s Baltimore facility. Northrop Grumman said its engineers continue to refine these processes and develop new manufacturing approaches.
Domestic capacity addresses supply-chain exposure
The company cited the semiconductor industry’s dependence on Taiwan and threats from China as reasons to expand U.S. production. It said additional domestic capacity would benefit Northrop Grumman programs and external defense and commercial customers.
The expansion is expected to support employment for thousands of Americans and contribute to local economies. Northrop Grumman said its domestic manufacturing investment also supports innovation and the development of long-term semiconductor expertise.
Source: Northrop Grumman.
