BAE Systems’ Endura processor demonstrates radiation-hardened performance for strategic space missions and trusted microelectronics

By Martin Chomsky (Defence Industry Europe)

Space/C4ISR |
BAE Systems’ Endura processor demonstrates radiation-hardened performance for strategic space missions and trusted microelectronics

Image: BAE Systems.

BAE Systems has demonstrated that its Endura system-on-chip space processor can operate resiliently in natural space and severe strategic radiation environments. The company said the milestone supports the processor’s use in space missions that require survivability in harsh radiation conditions.

“This milestone positions the Endura SoC as a leading high-performance processor for the space community,” said Joe Dziezynski, Space Systems product line director at BAE Systems. “Leveraging commercial foundry technology, Endura delivers a smaller, lower-power and more cost-effective solution for missions requiring survivability in harsh radiation.”

The Endura SoC was developed using BAE Systems’ commercial radiation-hardened 45 nanometer technology. The technology is built on GlobalFoundries’ commercial 45nm silicon-on-insulator platform, with secure manufacturing through GlobalFoundries’ New York fabrication facility.

 



 

BAE Systems said RH45 technology brings a qualified library of advanced, commercially licensed capabilities. It also uses proven application-specific integrated circuit design and manufacturing methods.

The strategic radiation-hardened testing further demonstrates that the technology can increase the survivability of other space system elements. These include single board computers used in space systems.

“GlobalFoundries’ facility in Malta, New York, is a cornerstone of trusted U.S. semiconductor manufacturing, providing the secure, domestic foundational technologies needed for mission-critical aerospace and defense applications,” said Ezra Hall, senior director of aerospace and defense at GF. “Working with the U.S. government, GF and BAE Systems are extending strategic manufacturing and technology advancements to address the evolving needs for resilient, trusted and scalable microelectronics.”

The SoC is being integrated into BAE Systems’ next-generation Endura product line. The product line will include general purpose processing, networking, secure boot and other functionality.

Endura products provide a processor core with integrated Level 1 and Level 2 caching. They also include advanced FPGA components designed to support mission-specific acceleration and hardware-accelerated input and output.

 




BAE Systems said these features are intended to deliver major improvements in size, speed, power and processing efficiency. As a platform-agnostic supplier, the company develops and produces high-reliability space electronics ranging from standard components and single board computers to complete system payloads.

The company said it will continue to provide products for High Reliability Class A missions. It will also support Class C and Class D lower mission assurance requirements with associated price points.

BAE Systems is currently accepting orders with rapid delivery for Software Development Units featuring the Endura SoC. Work is performed by the company’s Space Systems group in Manassas, Virginia.

The Manassas facility is a U.S. Department of War Category 1A Microelectronics Trusted Source. Its covered services include design, aggregation, broker, packaging, assembly and test.